Multisorb to Attend IMAPS 2012 Southeastern Microelectronics Packaging Conference
Buffalo, New York – December 2011
Multisorb Technologies has announced they will be attending International Microelectronics and Packaging Society’s (IMAPS) 2012 Southeastern Microelectronics Packaging Conference. The conference is being held on January 17, 2012 at the Rosen Centre Hotel in Orlando, Florida. The conference provides a forum for experts to discuss the latest advances and emerging applications in microelectronics and high density packaging.
Multisorb will be on hand to discuss options for extending service life and increasing the reliability of electronic devices and assemblies through the use of sorbent solutions. If you are designing an electronic product or have found that moisture, oxygen, and other contaminates are damaging your electronic products and components, Multisorb can design a solution specific to your need. Multisorb’s research and development scientists have extensive experience working with many electronics manufacturers to develop solutions for a variety of products such as hard disk drives, cameras, instrumentation, lasers, refrigeration, and more. With Drop-In, Fit-In, and Built-in formats available, a customizable format is available to fit your product’s needs.
Stop by and talk to us. The only thing you have to lose is unwanted moisture and contaminates.
