DesiMax SLF® Hot Melt is a technology that blends desiccants into a variety of hot melts to provide an extremely versatile, efficient, and cost-effective method for adsorbing moisture within packaging. DesiMax SLF Hot Melt can eliminate desiccant loading in the packaging operation.
Electronics and electro-optics
Provide easy application to package as a glue strip, line bead, thin film coating, or screen printing
Can be applied at the bottom of a vial, in the top of a cap, or on the inside of foil packaging
Eliminate loose packets or cartridges - they are virtually invisible to the consumer
Offer the flexibility to meet the requirements of a wide variety of new and more sophisticated packaging designs.
Are available with silica gel or molecular sieve compositions, with different blends available to meet specific packaging requirements.